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MG Chemicals 860 Silicone Heat Transfer Compound
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Key Features
- High thermal conductivity
- High dielectric constant
- High dissipation factor
- Use with heat sinks or metal chassis
- Contains zincs oxides and polydimenthyl siloxane
Product Description
Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
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